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Tuesday,Dec 13,2016

Backdrill is the process of creating vias by removing the stub in multilayer_ed printed wiring boards, to allow signals to flow from one layer of the board to another. It is a special craftsmanship of control depth drilling.

  • Reduce interference of other signal
  • Improve signal integrity
  • Reduce partial plate thickness
  • Reduce the use of blind and buried vias to reduce the difficulty of PCB fabrication
General Characteristics
  • Mostly are rigid boards on back
  • Normally used on 8 layers or above
  • Board thickness is over 2.5mm
  • Minimum hold size is 0.3mm
  • Backdrill is 0.2mm larger than the vias
  • Tolerance of backdrill depth+/-0.05MM