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The aluminum-based board is a unique metal-based copper-clad aluminum substrate with good thermal conductivity, electrical insulation properties and machinability. At present, ceramics, copper are generally high in heat conductivity, but most of the current market is aluminum substrates due to cost considerations. (1) Heat dissipation At present, many double-layer and multi-layer boards have high density, high power and difficult for heat dissipation. Conventional printed board substrates such as FR4 and CEM3 are poor conductors of heat, which are insulated between layers and heat is not emitted.
Flex PCBs are thin, light weight and easy bending, this gives much difficulty in the process of component assembly Stiffenersare used to reinforce those areas where components will be assembled There are many different material can be used as stiffeners, like polyimide, kapton, FR-4, A
Electronica 2018 will beheld from 13th-16th, November in Neue Messe München | Messegelände, 81823 München, Germany. Headpcb will attend this exhibition, welcome to visit our booth 165-7 hall A1, we will here wait for you!Waitting for you here to have a good communications about PCB, donn’t hesitate to talk with us!
Hardware company is used too broadly Both Square and SpaceX arehardwarecompanies, but with very different challenges It’s like lumping together enterprise Saas, social apps, and AI all together as software companies So I’d think about subcategories and challenges facing each
Plated half holes（castellated holes）are holes that made off the edge of the boards plated withcopper using a sp...
Comparison of several PCB surface finish typesAs for the essential proceed in PCB production, the basic purpose of surface treatment is to ensure good solderability or electrical properties. Since copper in nature tends to exist in the form of oxides in the air, it is unlikely to re...
PCB Via-in-PadWhen it comes to Vias, it’s known to us all that Vias can be divided into Through-hole Vias, Blind Vias and Buried Vias. They have different functions.With the development of the electronic products, Vias play a vital role in the interconnection between layers in a...
There are two wire bonding processes that are used,Thermosonic (T S)Gold Ball Wire BondingandUltrasonic (U S)Aluminum Wedge Wire Bonding Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to
WHAT IS RIGID-FLEX PCB?Rigid-flex PCB is a printed circuit consisting of both flexible circuit and rigid circuit This combination is ideal for exploiting the benefits of both flexible and rigid circuits - the rigid circuits can carry all or the bulk of the components, with the flexi
Ball Grid Array orBGAis asurface-mount package(with no leads) utilizing an array of metal spheres (solder balls) for electrical interconnection BGAsolder balls are attached to a laminated substrate at the bottom of the package The die of theBGAis connected to the substrate by wire bondi