Back Plane Board

Project Description

Parameters
32 Layer 
Thickness: 6.2+/-0.62 mm
Size: 870*540mm
Min Hole Size: Via: 0.65 mm 
Width/Space: 0.1mm/0.15 mm
Surface Treatment: ENIG


Craft
32 Layer

Unsymmetrical Layup Strcture

Application
Base Station