Via Tenting for PCB DesignTenting a via refers to covering via with soldermask to enclose or skin over the open
Via in pad is the design practice of placing aviain the copper landing pad of a component Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it Via in Pad? What makes them different from Traditional ViasWith traditional vias, the signal is routed away from the pad and then to the via This allows the application of soldermask to prevent solder paste from wicking into the via during the reflow process In doing so, this prevents a situation which can cause the pad and component connection to fail due to insufficient solder With via in pad, the drill hole for the via is inside the pad This means you can nottent the via with soldermask Leaving the via open to allow the paste to wick into
Normally, displacement reaction will happened between silver and copper, the low potential elements are oxidized by high-potential elements (electrons lost), while the high potential elements are electron-reduced by getting electrons. In the sinking silver cylinder, Ag ions are electron-reduced in this reaction (2Ag+ + 2e → 2Ag), and copper is oxidized to lose electrons (Cu-→Cu2++2e-). Thus, the oxidation of copper and the reduction of silver ions proceed simultaneously to form a uniform silver plating layer, as shown in the above reaction formula and Figure1 below.
COUNTER SINK VS COUNTERBORECOUNTER SINK Countersinking is done by making a cone shaped hole which allows a flat head fastener to sit flush when installed. This prevents any snagging or damage from the top of the fastener, which can happen if it isn t flush to the surface. With wood if you don t countersink and force the screw into the surface it will not only look bad, but the stability of the wood will be compromised. The wood can crack and split from the screw being forced and the fibers become damaged and dented. Countersinking also allows you to have all your screws at the same consistent depth.
With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development trend. The application of the resin plugging process has also become more and more extensive, and it has been used in HDI panels.
There are several surface treatment for PCB board: bare board (no treatment on the surface), rosin board, OSP (Organic Solderability Preservatives), HASL (lead tin, lead-free tin), plating gold, immersion gold, etc , these are relatively conscious treatment Many people can t tell the difference between plating gold and immersion gold, thinking that it is the same thing, it is a big mistake The following is a brief introduction to the difference between plating gold and immersion gold
Chinese New Year 2019 - time to prepare! The public Chinese New Year holidays 2019 are February 4th through to February 10th. As this is a nationwide national holiday it affects all production, and we are preparing action plans to find different ways of working around disruptions. All our efforts are always focused on your production, and our Management team will be manned during the whole Chinese New Year. But despite all the precautions we are taking, it could be good to think ahead and plan for the Chinese New Year to avoid disruption in your production.
The aluminum-based board is a unique metal-based copper-clad aluminum substrate with good thermal conductivity, electrical insulation properties and machinability. At present, ceramics, copper are generally high in heat conductivity, but most of the current market is aluminum substrates due to cost considerations. (1) Heat dissipation At present, many double-layer and multi-layer boards have high density, high power and difficult for heat dissipation. Conventional printed board substrates such as FR4 and CEM3 are poor conductors of heat, which are insulated between layers and heat is not emitted.
Flex PCBs are thin, light weight and easy bending, this gives much difficulty in the process of component assembly Stiffenersare used to reinforce those areas where components will be assembled There are many different material can be used as stiffeners, like polyimide, kapton, FR-4, A
Electronica 2018 will beheld from 13th-16th, November in Neue Messe München | Messegelände, 81823 München, Germany. Headpcb will attend this exhibition, welcome to visit our booth 165-7 hall A1, we will here wait for you!Waitting for you here to have a good communications about PCB, donn’t hesitate to talk with us!